The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Jul. 26, 2005
Kenji Yoshida, Yokohama, JP;
Kenji Yoshida, Yokohama, JP;
System Fabrication Technologies, Inc., Yokohama-shi, JP;
Abstract
The present invention provides a semiconductor device which can realize the mounting of a plurality of chips at a high-speed, with high packaging density and at a low cost. In mounting a memory device chipand an ASICon a wiring chip, connection padsare respectively formed along one opposing sides of the memory device chipand the ASICon the wiring chip, the arrangement positions of the respective connection padsdefine the shortest distance assumes the shortest distance therebetween and, at the same time wiring lines which are formed on the wiring chipare also shortened. Accordingly, it is possible to mount the memory device chipand the ASICon the wiring chipwith high packaging density and, at the same time, since the wiring distance can be shortened, the high speed operation can be realized.