The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Feb. 05, 2007
Radu M. Secareanu, Phoenix, AZ (US);
Suman K. Banerjee, Tucson, AZ (US);
Olin L. Hartin, Phoenix, AZ (US);
Sandra J. Wipf, Phoenix, AZ (US);
Radu M. Secareanu, Phoenix, AZ (US);
Suman K. Banerjee, Tucson, AZ (US);
Olin L. Hartin, Phoenix, AZ (US);
Sandra J. Wipf, Phoenix, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
Flip-chip electronic devices () employ bumps () for coupling to an external substrate. Device cells () and bumps () are preferably arranged in clusters () where four bumps () substantially surround each device cell () or form a cross with the device cell () at the intersection of the cross. The bumps () are desirably spaced apart by the minimum allowable bump () pitch (L). Typically, each device cell () contains one or more active device regions () depending on the overall function. Complex devices () are formed by an X-Y array of the clusters (), where adjacent clusters () may share bumps () and/or device cells (). In a preferred embodiment, the bumps () form the outer perimeter () of the device (). The maximum device temperature and overall noise is reduced.