The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Sep. 27, 2006
Kazuto Nishida, Katano, JP;
Hidenobu Nishikawa, Kadoma, JP;
Yoshinori Wada, Suita, JP;
Hiroyuki Otani, Ikoma, JP;
Kazuto Nishida, Katano, JP;
Hidenobu Nishikawa, Kadoma, JP;
Yoshinori Wada, Suita, JP;
Hiroyuki Otani, Ikoma, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.