The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Sep. 28, 2006
Kazuaki Yazawa, Chiba, JP;
Kazuaki Yazawa, Chiba, JP;
Sony Computer Entertainment Inc., Tokyo, JP;
Abstract
A semiconductor chipis mounted on a package substratewith its circuit side facing to a board. Heat is dissipated from an upper side of the semiconductor chipopposite to the circuit side. A sealing resinseals around the periphery of the semiconductor chipso that the upper side of the semiconductor chipis exposed to atmosphere. A fixing memberis buried in the sealing resinso that a hookformed on the tip of the fixing memberextends above the upper side of the semiconductor chip. A spreaderdissipates heat emitted from the semiconductor chip. A guiding slotis formed on the side facing to the package substrateof the spreader. The hooksof the fixing membersare inserted into the guiding slotsrespectively, and then the spreaderis rotated by predetermined angle against the package substrate. Then, the hookstravel along the slots. Through such process, the spreaderis pulled to come into contact with the upper side of the semiconductor chip