The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Nov. 17, 2006
Ming-shun Lee, Taipei, TW;
Ming-Shun Lee, Taipei, TW;
Taiwan Oasis Technology Co., Ltd., Taipei, TW;
Abstract
A chip packaging overflow proof device includes a chip disposed on a substrate; a circuit connected to the chip being provided to each of both sides of the substrate; both of the substrate and the chip being placed in a packaging base; a socket being each provided on both sides of the packaging base to receive insertion by a lid; a first cable-terminating hole being provided between the socket and the lid to permit the circuit to penetrate through; one or a plurality of retaining wall being disposed on the packaging base at where closer to the socket; a second cable-terminating hole being provided on the retaining hole; an overflow space being defined between the retaining wall and the socket; the overflow space being disposed at a level lower than that of the second cable-terminating hole; and the overflow space accepts any squeeze-out from a chip packaging colloid.