The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Jun. 02, 2008
Wei MA, New Territories, HK;
Xunqing Shu, New Territories, HK;
Chang Hwa Chung, New Territories, HK;
Wei Ma, New Territories, HK;
Xunqing Shu, New Territories, HK;
Chang Hwa Chung, New Territories, HK;
Hong Kong Applied Science and Technology Research Institute Company, Ltd., Shatin, New Territories, Hong Kong, CN;
Abstract
There is described a hybrid bonding method for through-silicon-via based wafer stacking. Patterned adhesive layers are provided to join together adjacent wafers in the stack, while solder bonding is used to electrically connect the vias. The adhesive layers are patterned to enable outgassing and to provide stress relief.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile