The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Sep. 12, 2006
Hyo Sun Lee, Daejeon Metropolitan, KR;
Dong Ryul Kim, Daejeon Metropolitan, KR;
Hee Jung Kim, Daejeon Metropolitan, KR;
Dae Woo Nam, Daejeon Metropolitan, KR;
Sang Uk Ryu, Daejeon Metropolitan, KR;
Boong Goon Jeong, Daejeon Metropolitan, KR;
Ju Eun Cha, Daegu Metropolitan, KR;
Ho Jun Lee, Daejeon Metropolitan, KR;
Hyo Sun Lee, Daejeon Metropolitan, KR;
Dong Ryul Kim, Daejeon Metropolitan, KR;
Hee Jung Kim, Daejeon Metropolitan, KR;
Dae Woo Nam, Daejeon Metropolitan, KR;
Sang Uk Ryu, Daejeon Metropolitan, KR;
Boong Goon Jeong, Daejeon Metropolitan, KR;
Ju Eun Cha, Daegu Metropolitan, KR;
Ho Jun Lee, Daejeon Metropolitan, KR;
LG Chem, Ltd., Seoul, KR;
Abstract
Disclosed are a negative C-type compensation film and a method of preparing the same. The negative C-type compensation film includes a) a base layer, and b) a polymer layer comprising polyarylate prepared by a method comprising the step of copolymerizing divalent phenols, divalent aromatic carboxylic acid halides, and allyl bisphenol derivatives, the base layer and the polymer layer being sequentially layered. The compensation film is capable of being used for the negative C-type compensation film without a stretching process, significantly reduces the thickness of the compensation film, and has significantly improved interlayer adhesion force in a multilayer structure.