The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Aug. 15, 2005
Kenji Ono, Tokyo, JP;
Teruo Ozaki, Yokohama, JP;
Toshiyasu Sakai, Yokohama, JP;
Ichiro Saito, Yokohama, JP;
Satoshi Ibe, Yokohama, JP;
Sakai Yokoyama, Kawasaki, JP;
Kazuaki Shibata, Kawasaki, JP;
Kenji Ono, Tokyo, JP;
Teruo Ozaki, Yokohama, JP;
Toshiyasu Sakai, Yokohama, JP;
Ichiro Saito, Yokohama, JP;
Satoshi Ibe, Yokohama, JP;
Sakai Yokoyama, Kawasaki, JP;
Kazuaki Shibata, Kawasaki, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
An ink jet head circuit board is provided which has heaters to generate thermal energy for ejecting ink as they are energized. This circuit board is so constructed as to reduce wire resistances for the heaters while at the same time preventing an increase in the size of the board and realizing a high-density integration of the heaters required for high resolution printing. This construction is made possible by forming electrode wires of first and second electrode wire layers to reduce an area that the wire patterns for the heater occupy on the circuit board. In reducing the effective thickness of protective insulation layer formed on the heater to prevent a possible degradation of thermal efficiency, one of the protective insulation layers over the electrode wires is removed from the heater, depending on the thickness of the electrode wires.