The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2010
Filed:
Feb. 25, 2005
Hwa-sun Lee, Suwon-si, KR;
Jae-woo Chung, Suwon-si, KR;
Seung-mo Lim, Yongin-si, KR;
Sung-gyu Kang, Suwon-si, KR;
Hwa-sun Lee, Suwon-si, KR;
Jae-woo Chung, Suwon-si, KR;
Seung-mo Lim, Yongin-si, KR;
Sung-gyu Kang, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
In a piezoelectric actuator for an ink-jet printhead, and a method of forming the same, formed on a flow path plate having a pressurizing chamber, the piezoelectric actuator for applying a driving force for ink ejection to the pressurizing chamber, the piezoelectric actuator includes a lower electrode formed on the flow path plate, a bonding pad formed on the flow path plate to be insulated from the lower electrode, wherein a driving circuit for voltage application is bonded to an upper surface of the bonding pad, a piezoelectric layer formed on the lower electrode at a position corresponding to the pressurizing chamber, wherein an end of the piezoelectric layer extends onto the bonding pad, and an upper electrode formed on the piezoelectric layer, wherein an end of the upper electrode extends beyond the end of the piezoelectric layer and contacts the upper surface of the bonding pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile