The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
Mar. 25, 2008
Takashi Inoue, Yonezawa, JP;
Kenichiro Fujimoto, Hitachi, JP;
Kentaro Segawa, Hitachi, JP;
Hitoshi Kimura, Hitachi, JP;
Tomiya Abe, Hitachi, JP;
Takashi Inoue, Yonezawa, JP;
Kenichiro Fujimoto, Hitachi, JP;
Kentaro Segawa, Hitachi, JP;
Hitoshi Kimura, Hitachi, JP;
Tomiya Abe, Hitachi, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
A high heat-resistance resin composition, the high heat-resistance resin composition being thermally treated at 150° C. for 100 hours, wherein a heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof by Differential Scanning Calorimetry (DSC) is equal to or less than 45 J/g before thermal treatment, an increasing rate of the heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof after the thermal treatment by Differential Scanning Calorimetry (DSC) is equal to or less than 20% as compared to that before the thermal treatment, and a degree of extensibility thereof is equal to or more than 200% after the thermal treatment.