The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
Jan. 13, 2005
Hiromi Yokota, Aichi, JP;
Daisuke Yoshitome, Aichi, JP;
Hiroaki Kobayashi, Aichi, JP;
Hiroyuki Kawaguti, Aichi, JP;
Hiromi Yokota, Aichi, JP;
Daisuke Yoshitome, Aichi, JP;
Hiroaki Kobayashi, Aichi, JP;
Hiroyuki Kawaguti, Aichi, JP;
Taiho Kogyo Co., Ltd., Toyota-Shi Aichi, JP;
Abstract
In a Pb-free copper-based sintered alloy containing from 1 to 30% of Bi and from 0.1 to 10% of hard matter particles having from 10 to 50 μm of average particle diameter, the Bi phase has a smaller average particle diameter than that of the hard matter particles and is dispersed in the Cu matrix, or the hard matter particles having 50% or less of a contact length ratio with the Bi phase based on the total circumferential length of the hard particle, which are in contact with said Bi phase, are present in a ratio of 70% or more based on the entire number of the hard matter particles.