The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
Feb. 21, 2008
Yoshihiro Watanabe, Hitachi, JP;
Katsutoshi Itagaki, Hitachi, JP;
Tomoyuki Haga, Hitachi, JP;
Hideaki Tagaya, Hitachi, JP;
Yoshihiro Watanabe, Hitachi, JP;
Katsutoshi Itagaki, Hitachi, JP;
Tomoyuki Haga, Hitachi, JP;
Hideaki Tagaya, Hitachi, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A method of increasing manufacturing efficiency of printed wiring boards is provided that includes packaging a photosensitive film roll with a resin case, wherein the photosensitive film roll is formed, by winding around a core, a photosensitive film that comprises a supporting film and a photosensitive resin composition layer formed on the supporting film, wherein the photosensitive resin composition layer comprises a photosensitive resin composition that contains a binder polymer and a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and a photopolymerization initiator, and wherein the resin case consists of a resin having a lower surface energy than the photosensitive resin composition.