The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
Feb. 02, 2007
Jin Cheol Kim, Gyeonggi-do, KR;
Min Soo Kim, Kyunggi-do, KR;
Jun Rok OH, Seoul, KR;
Tae Kyoung Kim, Gyeonggi-do, KR;
Jin Cheol Kim, Gyeonggi-do, KR;
Min Soo Kim, Kyunggi-do, KR;
Jun Rok Oh, Seoul, KR;
Tae Kyoung Kim, Gyeonggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Kyunggi-Do, KR;
Abstract
A method of manufacturing a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board manufactured by the method of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon.