The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
Jul. 12, 2007
Applicant:
Jung-chien Chang, Xinzhuang, TW;
Inventor:
Jung-Chien Chang, Xinzhuang, TW;
Assignee:
Mutual-Tek Industries Co., Ltd, Xinzhuang, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/22 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for forming a molded circuit board is provided. The method includes the steps of forming a circuit having a first section and a second section on a conductive substrate, the first section and the second section being coplanar; then deforming the conductive substrate by mold-pressing, so that the first section and the second section become non-coplanar; providing a plastic material to cover the circuit and the conductive substrate; curing the plastic material by injection-molding; and removing the conductive substrate to expose the circuit. The molded circuit board made by this method is also provided.