The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7675465 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 09, 2010

Filed:

May. 22, 2007
Applicants:

Chinh Huy Doan, Santa Clara, CA (US);

Mohammed Ershad Ali, San Jose, CA (US);

Inventors:

Chinh Huy Doan, Santa Clara, CA (US);

Mohammed Ershad Ali, San Jose, CA (US);

Assignee:

Sibeam, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate. In one embodiment, the second level interconnect for surface-mounting on a printed circuit board (PCB) is provided on the bottom layer of the substrate.


Find Patent Forward Citations

Doan, Chinh. (2010). Surface mountable integrated circuit packaging scheme (U.S. Patent No. 7675465). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7675465

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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