The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Dec. 06, 2004
Applicants:
Kazuyoshi Tendou, Tokyo, JP;
Mitsuo Katayose, Tsukuba, JP;
Inventors:
Kazuyoshi Tendou, Tokyo, JP;
Mitsuo Katayose, Tsukuba, JP;
Assignee:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08L 63/00 (2006.01); C08K 7/16 (2006.01); C08K 5/01 (2006.01);
U.S. Cl.
CPC ...
Abstract
An epoxy resin molding material for sealing which comprises an epoxy resin, an epoxy resin curing agent, and a pitch, as well as an electronic component comprising an element that is sealed with the molding material. This molding material exhibits favorable coloring properties, and even when used in packages with narrow distances between pads or wires, shorting defects caused by conductive materials can be prevented, as the molding material contains no conductive carbon black.