The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Dec. 31, 2007
Chang-yong Park, Chungcheongnam-do, KR;
Kwang-ho Chun, Chungcheongnam-do, KR;
Dong-chun Lee, Chungcheongnam-do, KR;
Yong-hyun Kim, Gyeonggi-do, KR;
Chang-Yong Park, Chungcheongnam-do, KR;
Kwang-Ho Chun, Chungcheongnam-do, KR;
Dong-Chun Lee, Chungcheongnam-do, KR;
Yong-Hyun Kim, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall. In this structure, the semiconductor package and the module PCB can have an excellent resistance to physical and thermal stresses to enhance structural reliability.