The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Oct. 18, 2006
Walther Lutz, Erding, DE;
Erwin Ruderer, Markt Schwaben, DE;
Walther Lutz, Erding, DE;
Erwin Ruderer, Markt Schwaben, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A process of manufacturing a semiconductor circuit includes providing a substrate layer, forming a metal layer above the substrate layer, incorporating circuit components in the substrate layer, and electrically connecting the circuit components to the metal layer. The process includes configuring the circuit components to perform an electrical function of the semiconductor circuit. The semiconductor circuit has a specific electrical conductivity between the substrate layer and the metal layer based on the electrical function performed. The process includes increasing the electrical conductivity between the substrate layer and the metal layer compared with the specific electrical conductivity.