The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Jun. 25, 2008
Minoru Takizawa, Sagamihara, JP;
Kuniyasu Hosoda, Hanno, JP;
Takahisa Funayama, Akishima, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, there is provided a printed circuit board includes a printed wiring board having a component mounting surface, a semiconductor package which is mounted on the component mounting surface of the printed wiring board by solder bonding using solder balls, and reinforcement portions which locally reinforce portions of the solder bonding of the semiconductor package at a plurality of locations on the component mounting surface of the printed wiring board, the reinforcement portions being formed of a resin material having parts entering the solder balls of the portions of the solder bonding.