The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Mar. 11, 2005
Keizo Nakajima, Osaka, JP;
Takahito Ishii, Kyoto, JP;
Keiko Yasui, Nara, JP;
Seishi Terakado, Nara, JP;
Takehiko Shigeoka, Nara, JP;
Kazuyuki Kohara, Kyoto, JP;
Mitsuru Yoneyama, Nara, JP;
Keizo Nakajima, Osaka, JP;
Takahito Ishii, Kyoto, JP;
Keiko Yasui, Nara, JP;
Seishi Terakado, Nara, JP;
Takehiko Shigeoka, Nara, JP;
Kazuyuki Kohara, Kyoto, JP;
Mitsuru Yoneyama, Nara, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A heating element includes a base substrate, a pair of electrodes, a resistor capable of generating heat, a conductive resin, a terminal member, a hot melt adhesion metal, a hot melt cohesion metal, and a lead wire. The pair of electrodes is provided on the base substrate, and the resistor is formed between the pair of electrodes. The conductive resin is provided on each of the electrodes, and the terminal member is provided on the conductive resin. The adhesion metal is provided on the terminal member, and the cohesion metal forms a molten phase along with the adhesion metal. An end of the lead wire is welded to the cohesion metal. The conductive resin is provided in the vicinity of the adhesion metal so as to be affected by heat of the adhesion metal.