The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Dec. 28, 2005
Gi Ra Yi, Daejeon, KR;
Jong Pil Kim, Daejeon, KR;
Jung Hee Lee, Gyeonggi-do, KR;
Jeong Jin Hong, Daejeon, KR;
Young Jun Hong, Daejeon, KR;
NO MA Kim, Daejeon, KR;
An NA Lee, Daejeon, KR;
Gi Ra Yi, Daejeon, KR;
Jong Pil Kim, Daejeon, KR;
Jung Hee Lee, Gyeonggi-do, KR;
Jeong Jin Hong, Daejeon, KR;
Young Jun Hong, Daejeon, KR;
No Ma Kim, Daejeon, KR;
An Na Lee, Daejeon, KR;
LG Chem. Ltd., Seoul, KR;
Abstract
Disclosed is an adjuvant for use in simultaneous polishing of a cationically charged material and an anionically charged material, which forms a adsorption layer on the cationically charged material in order to increase the polishing selectivity of the anionically charged material to cationically charged material, wherein the adjuvant comprises a polyelectrolyte salt containing: (a) a graft type polyelectrolyte that has a weight average molecular weight of 1,000˜20,000 and comprises a backbone and a side chain; and (b) a basic material. CMP (chemical mechanical polishing) slurry comprising the above adjuvant and abrasive particles is also disclosed.