The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2010
Filed:
Apr. 17, 2009
Kuo-len Lin, Wugu Township, Taipei County, TW;
Chen-hsiang Lin, Wugu Township, Taipei County, TW;
Mong-hua Hung, Wugu Township, Taipei County, TW;
Chiao-li Huang, Wugu Township, Taipei County, TW;
Ken Hsu, Wugu Township, Taipei County, TW;
Chih-hung Cheng, Wugu Township, Taipei County, TW;
Kuo-Len Lin, Wugu Township, Taipei County, TW;
Chen-Hsiang Lin, Wugu Township, Taipei County, TW;
Mong-Hua Hung, Wugu Township, Taipei County, TW;
Chiao-Li Huang, Wugu Township, Taipei County, TW;
Ken Hsu, Wugu Township, Taipei County, TW;
Chih-Hung Cheng, Wugu Township, Taipei County, TW;
CPUMate Inc., Taipei, TW;
Golden Sun News Techniques Co., Ltd., Tapei, TW;
Abstract
An LED lighting device with a heat dissipating structure is disclosed. The lighting device includes a lamp base coupled with a top cover to form an accommodating space for accommodating a first heat dissipating module and a second heat dissipating module. The first heat dissipating module includes a first heat-conducting plate, a first heat pipe and a first heat dissipater. An LED lighting module is connected with the first heat-conducting plate, in which an evaporator section of the first heat pipe is disposed thereon. The first heat dissipater is arranged on a condenser section of the first heat pipe, and the second heat dissipating module includes a second heat-conducting plate and a second heat pipe. The second heat-conducting plate paralleling to the first heat-conducting plate is connected with the LED lighting module. An evaporator section of the second heat pipe is disposed on the second heat-conducting plate, and whose condenser section is connected with an inner surface of the top cover. Whereby, the heat generated from the LED lighting module can be dissipated uniformly and rapidly.