The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
Dec. 17, 2008
Junya Shimakawa, Sabae, JP;
Hideyuki Fujiki, Echizen, JP;
Keiji Ogawa, Fukui, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
An electronic component module includes a module body including a substrate having components mounted thereon. A metal case is attached to the substrate to cover the components of the module body. The metal case includes a top-plate portion arranged substantially parallel to the main surface of the substrate and claw portions arranged at both edges thereof. The claw portions each include a claw body defined by a rectangular portion that is bent at an edge of the top-plate portion and extends in the direction of the substrate and a holding claw. In addition, contacting portions are bent at both ends of the rectangular portion to extend towards the inner portion of the main surface of the substrate. The contacting portions come into contact with the main surface of the substrate, and the holding claws are soldered to the side surfaces of the substrate. Accordingly, it is possible to provide an electronic component module in which the proportion of a mounting area, in which components can be mounted, to a main surface of a substrate is increased, and in which positioning of a metal case can be easily performed.