The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
Nov. 09, 2006
Angelo M. Puzella, Marlborough, MA (US);
Joseph M. Crowder, Marlboro, MA (US);
Patricia S. Dupuis, Medway, MA (US);
Michael C. Fallica, Reading, MA (US);
John B. Francis, Littleton, MA (US);
Joseph A. Licciardello, Nashua, NH (US);
Angelo M. Puzella, Marlborough, MA (US);
Joseph M. Crowder, Marlboro, MA (US);
Patricia S. Dupuis, Medway, MA (US);
Michael C. Fallica, Reading, MA (US);
John B. Francis, Littleton, MA (US);
Joseph A. Licciardello, Nashua, NH (US);
Raytheon Company, Waltham, MA (US);
Abstract
A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.