The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
Sep. 27, 2006
Yasushi Kinoshita, Hitachinaka, JP;
Norio Nakazato, Inzai, JP;
Naoki Yotsumoto, Ome, JP;
Keisuke Nishimura, Ome, JP;
Daisuke Nakahara, Ome, JP;
Yasushi Kinoshita, Hitachinaka, JP;
Norio Nakazato, Inzai, JP;
Naoki Yotsumoto, Ome, JP;
Keisuke Nishimura, Ome, JP;
Daisuke Nakahara, Ome, JP;
Hitachi Lighting, Ltd., Tokyo, JP;
Abstract
When a long illuminant module is constructed, debonding of a bonded interface or bending occurs due to a difference in a magnitude of thermal deformation between a lens material and a metal substrate. In an illuminant module including light emitting elements, a substrate on which the light emitting elements are mounted, a transparent encapsulating resin which encapsulates the light emitting elements, and a lens material having cavities formed therein, in which the respective light emitting elements and transparent encapsulating resin are stored, notches are formed in a surface of the lens material on the side of the substrate, and the notch surfaces of the notches and the surface of the substrate are bonded using a bonding material.