The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7671477 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 02, 2010

Filed:

Dec. 05, 2006
Applicant:

Hironobu Ikeda, Tokyo, JP;

Inventor:

Hironobu Ikeda, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

A device comprises a plurality of first electrodes which are arranged on a surface of a substrate at predetermined space, a component which has an elasticity and a longitudinal axis, a plurality of conductors which are applied to a surface of said component at predetermined space, and each of which are connected to a corresponding one of said first electrodes, and a plurality of second electrodes which are arranged on a surface of a electronic component at predetermined space, and each of which are connected to a corresponding one of said conductors.


Find Patent Forward Citations

Ikeda, Hironobu. (2010). Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component (U.S. Patent No. 7671477). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7671477

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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