The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
May. 10, 2007
Kenichi Nonaka, Saitama, JP;
Takeshi Kato, Saitama, JP;
Kenji Oogushi, Saitama, JP;
Yoshihiko Higashidani, Saitama, JP;
Yoshimitsu Saito, Saitama, JP;
Kenji Okamoto, Saitama, JP;
Kenichi Nonaka, Saitama, JP;
Takeshi Kato, Saitama, JP;
Kenji Oogushi, Saitama, JP;
Yoshihiko Higashidani, Saitama, JP;
Yoshimitsu Saito, Saitama, JP;
Kenji Okamoto, Saitama, JP;
Honda Motor Co., Ltd., Tokyo, JP;
Abstract
A power semiconductor module having an integral circuit board with a metal substrate electrode, an insulation substrate and a heat sink joined is disclosed. A SiC semiconductor power device is joined to a top of the metal substrate electrode of the circuit board. A difference in average coefficients of thermal expansion between constituent materials of the circuit board in a temperature range from room to joining time temperatures is 2.0 ppm/° C. or less, and a difference in expansion, produced by a difference between a lowest operating temperature and a joining temperature, of the circuit-board constituent materials is 2,000 ppm or less.