The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2010

Filed:

May. 02, 2008
Applicants:

Ahmed Nur Amin, Fairfax, VA (US);

Mark Adam Bachman, Sinking Spring, PA (US);

David Lee Crouthamel, Bethlehem, PA (US);

John William Osenbach, Kutztown, PA (US);

Brian Thomas Vaccaro, Mertztown, PA (US);

Inventors:

Ahmed Nur Amin, Fairfax, VA (US);

Mark Adam Bachman, Sinking Spring, PA (US);

David Lee Crouthamel, Bethlehem, PA (US);

John William Osenbach, Kutztown, PA (US);

Brian Thomas Vaccaro, Mertztown, PA (US);

Assignee:

Agere Systems Inc., Allentown, PA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.


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