The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2010

Filed:

Jun. 21, 2006
Applicants:

Jin Hyuk Lee, Gyeonggi-do, KR;

SI Moo Lee, Gyeonggi-do, KR;

Jae Wook Lee, Gyeonggi-do, KR;

Inventors:

Jin Hyuk Lee, Gyeonggi-do, KR;

Si Moo Lee, Gyeonggi-do, KR;

Jae Wook Lee, Gyeonggi-do, KR;

Assignee:

KCC Corporation, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 3/078 (2006.01); C03C 3/085 (2006.01); C03C 3/087 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a glass substrate composition comprising SiO55˜70 wt %, AlO0˜1 wt %, ZrO0.1˜5 wt %, NaO 0.1˜5 wt %, KO 7˜13 wt %, MgO 7˜14 wt %, CaO 0˜4 wt %, SrO 7˜12 wt % and SO0.01˜0.5 wt %. The glass substrate prepared by using the above composition shows less thermal deformation at a baking process under a high temperature since the strain point of the glass is at least 570° C., does not have such disadvantages as increase of fuel cost and short life cycle of refractories resulted from less than 1460° C. of melting point, and has 80˜95×10/° C. of thermal expansion coefficient in the temperature range of 50˜350° C. Therefore, the glass according to the present invention is suitable as a substrate.


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