The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
Oct. 17, 2005
Masataka Mizukoshi, Kawasaki, JP;
Kanae Nakagawa, Kawasaki, JP;
Takeshi Shioga, Kawasaki, JP;
Kazuaki Kurihara, Kawasaki, JP;
John David Baniecki, Kawasaki, JP;
Masataka Mizukoshi, Kawasaki, JP;
Kanae Nakagawa, Kawasaki, JP;
Takeshi Shioga, Kawasaki, JP;
Kazuaki Kurihara, Kawasaki, JP;
John David Baniecki, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
The plating method comprises the step of forming a resin layerover a substrate; the step of cutting the surface part of the resin layerwith a cutting tool; the step of forming a seed layeron the resin layerby electroless plating; and the step of forming a plating filmon the seed layerby electroplating. Suitable roughness can be give to the surface of the resin layer, whereby the adhesion between the seed layerand the resin layercan be sufficiently ensured. Excessively deep pores are not formed in the surface of the resin layer, as are by desmearing treatment, whereby a micronized pattern of a photoresist filmcan be formed on the resin layer. Thus, interconnections, etc. can be formed over the resin layerat a narrow pitch with high reliability ensured.