The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2010

Filed:

Oct. 26, 2005
Applicant:

Xiantao Yan, San Jose, CA (US);

Inventor:

Xiantao Yan, San Jose, CA (US);

Assignee:

LED Engin, Inc. (Cayman), Grand Cayman, British West Indies, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of forming LED packages and light emitting devices are provided. LED packages and light emitting devices are preferably formed from ceramic layers, such as AlN, though layers of non-ceramic materials can also be used. The layers are formed to include vias, apertures, and metallization layers. The layers are then bonded together to form a panel. The panel is scribed to form a grid of snap lines and then the panel is fractured along the snap lines. To form light emitting devices from the panel, LED dies are added and encapsulated before the panel is fractured.


Find Patent Forward Citations

Yan, Xiantao. (2010). Method of manufacturing ceramic led packages (U.S. Patent No. 7670872). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7670872

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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