The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
Jan. 25, 2008
Young Woo Lee, Incheon, KR;
Kyung IN Kang, Gyeonggi-do, KR;
Byung Wook Jeong, Chungcheongbuk-do, KR;
Jai Pil Jung, Seoul, KR;
Ki Ju Lee, Seoul, KR;
Hee Yul Lee, Seoul, KR;
Young Woo Lee, Incheon, KR;
Kyung In Kang, Gyeonggi-do, KR;
Byung Wook Jeong, Chungcheongbuk-do, KR;
Jai Pil Jung, Seoul, KR;
Ki Ju Lee, Seoul, KR;
Hee Yul Lee, Seoul, KR;
MK Electron Co., Ltd., Yongin, KR;
Abstract
A lead free solder is provided. The lead free solder includes about 1.5 wt % to about 2.5 wt % silver (Ag), about 3 wt % to about 6 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % of a deoxidizing agent, and a balance of tin (Sn). The lead free solder has improved wettability, a lowered melting point, little or substantially no formation of oxidation layer in a solder bath, suppressed brittleness, improved thermal shock resistance and drop resistance.