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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7670447 B1

PDFFull Text
Date of Patent:
Mar. 02, 2010

Filed:

Mar. 25, 2003

Method for applying adhesive to substrate, substrate, coating device, method for producing laminated object, and laminated object

Applicants:

Yukihiko Minamida, Osaka, JP;

Tomoaki Harada, Sakura, JP;

Toyokuni Fujiwara, Osaka, JP;

Takayoshi Ito, Ageo, JP;

Nobuhiko Endo, Matsudo, JP;

Inventors:

Yukihiko Minamida, Osaka, JP;

Tomoaki Harada, Sakura, JP;

Toyokuni Fujiwara, Osaka, JP;

Takayoshi Ito, Ageo, JP;

Nobuhiko Endo, Matsudo, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:

Edwards Angell Palmer & Dodge LLP

Primary Examiner:

Jeff H Aftergut

Int. Cl.
CPC ...
B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for coating a substrate and a coating device used therein that can smoothly form an adhesive layer on the surface of a substrate without roughening, is provided which do not require a drying process and is free of various problems such as sick house syndrome stemming from use of organic solvents. In addition, a method of producing a laminated object using the coating method and the laminated object obtained thereby are provided. In the method for coating a substrate to form an adhesive layer on one surface of the substrate, while the substrate is being conveyed by applying a hot melt adhesive in a melted state via a rotating applicator roller, with the direction of rotation of the applicator roller and the direction of conveying the substrate being the same, adhesive is applied to the substrate while slipping the applicator roller by setting the circumferential speed of the applicator roller to be at least 20% slower or at least 20% faster than the predetermined speed at which the substrate is conveyed.

Find Patent Forward Citations

Minamida, Yukihiko. (2010). Method for applying adhesive to substrate, substrate, coating device, method for producing laminated object, and laminated object (U.S. Patent No. 7670447). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7670447

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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