The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2010
Filed:
Dec. 18, 2002
Applicants:
Andre Jeutter, Grafenau, DE;
Silke Settegast, Berlin, DE;
Inventors:
Andre Jeutter, Grafenau, DE;
Silke Settegast, Berlin, DE;
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 6/00 (2006.01); B63H 1/26 (2006.01);
U.S. Cl.
CPC ...
Abstract
It is known from the prior art that holes in a workpiece are filled completely with a solder powder, which leads especially in the case of large holes to the formation of cracks within the solder due to the large volume filled in once the solder cools off after soldering. The invention provides a method for closing a recess of a workpiece, which allows closing an opening of a recess without the risk of crack formation, by using only a solder film for closing the recess. The solder film has a content of non-melting material and therefore is substantially less prone to form cracks.