The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2010

Filed:

Feb. 22, 2008
Applicants:

Marzia Rosso, Turin, IT;

Alessandro Stano, Turin, IT;

Ruiyu Fang, Turin, IT;

Paolo Valenti, Turin, IT;

Pietro Della Casa, Turin, IT;

Simone Codato, Turin, IT;

Cesare Rigo, Turin, IT;

Claudio Coriasso, Turin, IT;

Inventors:

Marzia Rosso, Turin, IT;

Alessandro Stano, Turin, IT;

Ruiyu Fang, Turin, IT;

Paolo Valenti, Turin, IT;

Pietro Della Casa, Turin, IT;

Simone Codato, Turin, IT;

Cesare Rigo, Turin, IT;

Claudio Coriasso, Turin, IT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 3/08 (2006.01); H01S 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A photonic semiconductor device and method are provided that ensure that the surface of the device upon completion of the SAG process is planar, or at least substantially planar, such that performance of the subsequent processes is facilitated, thereby enabling higher manufacturing yield to be achieved. A photonic semiconductor device and method are also provided that ensure that the isolation region of the device will have high resistance and low capacitance, without requiring the placement of a thick dielectric material beneath each of the contact pads. Eliminating the need to place thick dielectric materials underneath the contact pads eliminates the risk that the contact pads will peel away from the assembly.


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