The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2010
Filed:
Dec. 29, 2006
Eun Jung Lee, Incheon-si, KR;
Yoon Kok Park, Suwon-si, KR;
Young Kyun Lee, Seoul, KR;
Whan Gun Kim, Seoul, KR;
Suk Ku Chang, Yongin-si, KR;
Eun Jung Lee, Incheon-si, KR;
Yoon Kok Park, Suwon-si, KR;
Young Kyun Lee, Seoul, KR;
Whan Gun Kim, Seoul, KR;
Suk Ku Chang, Yongin-si, KR;
Cheil Industries, Inc., Gumi-so, Gyeongsangbuk-do, KR;
Abstract
An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of Rthrough R, independently, represents a hydrogen atom or a C-Chydrocarbon group, provided that when Rthrough Rare C-Chydrocarbon groups, Rand R, Rand R, Rand R, Rand R, Rand R, and Rand Rcan be joined to each other to form a cyclic structure.