The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2010

Filed:

Aug. 25, 2003
Applicants:

Amlan Datta, Rancho Cucamonga, CA (US);

Hamid Hojaji, Claremont, CA (US);

David L. Melmeth, Upland, CA (US);

James A. Mcfarlane, Rancho Cucamonga, CA (US);

Thinh Pham, Kensington, AU;

Noel E. Thompson, Carlingford, AU;

Huagang Zhang, Yucaipa, CA (US);

Inventors:

Amlan Datta, Rancho Cucamonga, CA (US);

Hamid Hojaji, Claremont, CA (US);

David L. Melmeth, Upland, CA (US);

James A. McFarlane, Rancho Cucamonga, CA (US);

Thinh Pham, Kensington, AU;

Noel E. Thompson, Carlingford, AU;

Huagang Zhang, Yucaipa, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01); C03C 10/04 (2006.01); C03C 10/06 (2006.01); C03C 10/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A synthetic microsphere having a low alkali metal oxide content and methods of forming the microsphere and its components are provided. The synthetic microsphere is substantially chemically inert and thus a suitable replacement for natural cenospheres, particularly in caustic environments such as cementitious mixtures. The synthetic microsphere can be made from an agglomerate precursor that includes an aluminosilicate material, such as fly ash, a blowing agent such as sugar, carbon black, and silicon carbide, and a binding agent. The synthetic microsphere is produced when the precursor is fired at a pre-determined temperature profile so as to form either solid or hollow synthetic microspheres depending on the processing conditions and/or components used.


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