The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2010
Filed:
Jan. 17, 2006
Applicants:
Jae Choon Cho, Gyeonggi-do, KR;
IL Sang Maeng, Gyeonggi-do, KR;
Choon Keun Lee, Gyeonggi-do, KR;
Seung Hyun Ra, Gyeonggi-do, KR;
Inventors:
Jae Choon Cho, Gyeonggi-do, KR;
Il Sang Maeng, Gyeonggi-do, KR;
Choon Keun Lee, Gyeonggi-do, KR;
Seung Hyun Ra, Gyeonggi-do, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.