The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2010

Filed:

Jan. 24, 2005
Applicants:

Hiroshi Yamasaki, Kanagawa, JP;

Hiroshi Ootsuki, Kanagawa, JP;

Yutaka Igarashi, Saitama, JP;

Inventors:

Hiroshi Yamasaki, Kanagawa, JP;

Hiroshi Ootsuki, Kanagawa, JP;

Yutaka Igarashi, Saitama, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a component mounting inspecting apparatus which can automatically set a solder bridge inspection region (an inspection point) and output an optimum inspection result of a solder bridge. The component mounting board inspecting apparatus for inspecting a solder bridge of an electronic circuit board, in which a plurality of electrode pads are formed at predetermined spaced intervals and cream solder is applied on the electrode pads, includes a mechanism for automatically determining a distance between adjacent electrode pads and a mechanism for automatically setting a solder bridge inspection point if the distance between the adjacent electrode pads is equal to or shorter than a threshold value.


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