The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2010

Filed:

Jun. 07, 2006
Applicants:

Don Chul Choi, Incheon, KR;

Jae Cheol Ju, Gyeonggi-do, KR;

Dong Hwan Lee, Gyeonggi-do, KR;

Sang Soo Park, Gyeonggi-do, KR;

Hee Soo Yoon, Gyeonggi-do, KR;

Inventors:

Don Chul Choi, Incheon, KR;

Jae Cheol Ju, Gyeonggi-do, KR;

Dong Hwan Lee, Gyeonggi-do, KR;

Sang Soo Park, Gyeonggi-do, KR;

Hee Soo Yoon, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.


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