The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7663254 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 16, 2010

Filed:

Jul. 15, 2008
Applicant:

Toshiyuki Hara, Kanagawa, JP;

Inventor:

Toshiyuki Hara, Kanagawa, JP;

Assignee:

NEC Electronics Corporation, Kawasaki, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a semiconductor apparatus which includes a substrate, a semiconductor chip mounted above the substrate, a first resin filled between the substrate and the semiconductor chip, and a second resin formed on the substrate and extending from a side surface of the semiconductor chip toward an outer edge of the substrate. The second resin extends from an intersection of an extension of the side surface of the semiconductor chip and the substrate toward the outer edge of the substrate so that a first stress generated on a contact surface between the first resin and the semiconductor chip and a second stress generated on a contact surface between the first resin or the second resin and the substrate balance out each other.


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Hara, Toshiyuki. (2010). Semiconductor apparatus and method of manufacturing the same (U.S. Patent No. 7663254). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7663254

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