The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2010
Filed:
Jan. 05, 2005
Applicants:
Kyung-lae Jang, Seongnam-si, KR;
Hee-seok Lee, Suwon-si, KR;
Inventors:
Kyung-Lae Jang, Seongnam-si, KR;
Hee-Seok Lee, Suwon-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 23/52 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package circuit board having a reduced package size. The package circuit board may include a semiconductor substrate in place of a printed circuit board. The package circuit board may further include a microelectronic chip mounted on the semiconductor substrate, the microelectronic chip having at least one of active and passive elements formed on the semiconductor substrate semiconductor substrate.
Jang, Kyung-Lae. (2010). Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same (U.S. Patent No. 7663221). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7663221
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile