The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2010
Filed:
Nov. 30, 2004
Kenji Kitamura, Sayama, JP;
Shinichi Yataka, Sayama, JP;
Takao Endo, Sayama, JP;
Yuujiro Tominaga, Sayama, JP;
Toshihide Tanaka, Sayama, JP;
Koichiro Sato, Sayama, JP;
Kenji Kitamura, Sayama, JP;
Shinichi Yataka, Sayama, JP;
Takao Endo, Sayama, JP;
Yuujiro Tominaga, Sayama, JP;
Toshihide Tanaka, Sayama, JP;
Koichiro Sato, Sayama, JP;
Honda Motor Co., Ltd., Tokyo, JP;
Abstract
A semiconductor module includes: a semiconductor element () having a working unit () and a guard ring unit (); and heat radiation members () arranged on an upper surface and a lower surface of the semiconductor element for cooling the semiconductor element. A passivation film () covers the guard ring but does not cover the working unit. The upper heat radiation member () is made of a flat metal plate connected to the working unit without contact with the passivation film. The upper heat radiation member is connected to the lower heat radiation member () in the thermo-conducting way.