The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2010
Filed:
May. 30, 2006
Seon Goo Lee, Kyungki-do, KR;
Hun Joo Hahm, Kyungki-do, KR;
Dae Yeon Kim, Kyungki-do, KR;
Young Jae Song, Kyungki-do, KR;
Young Sam Park, Seoul, KR;
Chang Ho Song, Seoul, KR;
Seon Goo Lee, Kyungki-do, KR;
Hun Joo Hahm, Kyungki-do, KR;
Dae Yeon Kim, Kyungki-do, KR;
Young Jae Song, Kyungki-do, KR;
Young Sam Park, Seoul, KR;
Chang Ho Song, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Kyungki-Do, KR;
Abstract
The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.