The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7662890 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 16, 2010

Filed:

Mar. 29, 2005
Applicants:

Misao Aida, Kanagawa, JP;

Osamu Ishizu, Kanagawa, JP;

Hisanori Ota, Kanagawa, JP;

Inventors:

Misao Aida, Kanagawa, JP;

Osamu Ishizu, Kanagawa, JP;

Hisanori Ota, Kanagawa, JP;

Assignee:

Zeon Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 8/00 (2006.01); C08F 236/14 (2006.01); A41D 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A dip-forming composition of the present invention comprises a dip-forming latex containing a copolymer obtained by copolymerizing 100 parts by weight of a monomer mixture containing 70 to 85 parts by weight of a conjugated diene monomer, 10 to 28 parts by weight of an aromatic vinyl monomer, 2 to 5 parts by weight of an ethylenically unsaturated acid monomer and 0 to 18 parts by weight of other monomer copolymerizable with these monomers, said copolymer having a toluene insoluble content of 30% by weight or more and a toluene swelling degree of 70 times or less; and a vulcanizing agent, a vulcanization accelerator and zinc oxide which are blended in said latex in amounts of 0.5 to 2 parts by weight, 0.25 to 1 part by weight and 0.5 to 1 part by weight, respectively, on the basis of 100 parts by weight of a solid content of the latex. There can be provided a dip-formed article exhibiting an excellent touch and feel, sufficient tensile strength and elongation at break and an excellent persistence of close fitting, as well as a dip-forming composition capable of providing such a dip-formed article.


Find Patent Forward Citations

Aida, Misao. (2010). Composition for dip forming and molding obtained by dip forming (U.S. Patent No. 7662890). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7662890

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