The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2010

Filed:

Feb. 14, 2001
Applicants:

Shoji Hara, Kanagawa, JP;

Takashi Itoh, Shiga, JP;

Hitoshi Nojiri, Shiga, JP;

Masaru Nishinaka, Shiga, JP;

Inventors:

Shoji Hara, Kanagawa, JP;

Takashi Itoh, Shiga, JP;

Hitoshi Nojiri, Shiga, JP;

Masaru Nishinaka, Shiga, JP;

Assignee:

Kaneka Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); C23C 14/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A laminate comprising a polyimide and a conductor layer, which is obtained by forming at least one conductor layer directly on the surface of a thermoplastic polyimide, is thermally fused by pressurizing and heating to thereby enhance the adhesion strength between the thermoplastic polyimide and the conductor layer. Thus, a laminate having an excellent adhesion strength between a conductor layer and a polyimide film can be obtained without performing any surface roughening treatment or using any adhesive metal layer.


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