The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2010
Filed:
Mar. 18, 2004
Applicants:
Takayuki Murai, Kagawa, JP;
Yoshimasa Kikukawa, Kagawa, JP;
Hirohiko Hirao, Kagawa, JP;
Inventors:
Assignee:
Shikoku Chemicals Corporation, Marugame-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1): wherein Ris hydrogen or methyl, and either Rand Rrepresent chlorine and Rand Rrepresent hydrogen, or Rand Rrepresent hydrogen and Rand Rrepresent chlorine.