The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2010

Filed:

Apr. 20, 2006
Applicants:

Soo-kwang Kim, Portofino, CA (US);

Hee-dong Park, Kyungki-do, KR;

Jong-ho Kim, Kyungki-do, KR;

Joon-ho Chang, Kyungki-do, KR;

Inventors:

Soo-Kwang Kim, Portofino, CA (US);

Hee-Dong Park, Kyungki-do, KR;

Jong-Ho Kim, Kyungki-do, KR;

Joon-Ho Chang, Kyungki-do, KR;

Assignees:

Ehwa Diamond Industrial Co., Ltd., Osan, Kyungki-do, KR;

General Tool, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D 1/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.


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