The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Aug. 09, 2006
Yasuhiro Onishi, Kyoto, JP;
Masanobu Horino, Kyoto, JP;
Katsumi Ohashi, Kyoto, JP;
Omron Corporation, Kyoto-Shi, JP;
Abstract
A solder material test apparatus includes a control unit and a storage unit which stores master data in advance in which a printing process time when a printing process is performed by using a test-sample solder material is associated with deterioration degree data of the test-sample solder material at the printing process time. The control unit includes a deterioration degree data acquiring unit which acquires deterioration degree data for indicating a deterioration degree of a test-sample solder material, a reading unit which reads a printing process time associated with deterioration degree data set as a limit value with reference to master data and reads a printing process time associated with the deterioration degree data acquired by the deterioration degree data acquiring unit, an operating unit which operates an available remaining time that indicates difference between the printing process times, and a display control unit which informs the available remaining time to a user.