The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Dec. 30, 2004
Richard Marion Czerwiec, Raleigh, NC (US);
Manal Afify, Raleigh, NC (US);
Atahan Tuzel, Raleigh, NC (US);
Barry Lee Moffitt, Cary, NC (US);
Joseph Lee Smith, Fuquay Varina, NC (US);
Anthony Peter Noto, Knightdale, NC (US);
David Charles Fargo, Cary, NC (US);
Bobby Lane English, Raleigh, NC (US);
John David Boyle, Cary, NC (US);
Alain Granger, Raleigh, NC (US);
Jak Yaemsiri, Raleigh, NC (US);
Andreas Flach, Wake Forest, NC (US);
John Scott Cao, Raleigh, NC (US);
Ali Rezaki, Antwerp, BE;
Charles Pearse, Ottawa, CA;
Bakri Aboukarr, Ottawa, CA;
Arkin Aydin, Nepean, CA;
Angelo Arlotta, Ottawa, CA;
Nicholas Adam Bundza, Ottawa, CA;
Richard Marion Czerwiec, Raleigh, NC (US);
Manal Afify, Raleigh, NC (US);
Atahan Tuzel, Raleigh, NC (US);
Barry Lee Moffitt, Cary, NC (US);
Joseph Lee Smith, Fuquay Varina, NC (US);
Anthony Peter Noto, Knightdale, NC (US);
David Charles Fargo, Cary, NC (US);
Bobby Lane English, Raleigh, NC (US);
John David Boyle, Cary, NC (US);
Alain Granger, Raleigh, NC (US);
Jak Yaemsiri, Raleigh, NC (US);
Andreas Flach, Wake Forest, NC (US);
John Scott Cao, Raleigh, NC (US);
Ali Rezaki, Antwerp, BE;
Charles Pearse, Ottawa, CA;
Bakri Aboukarr, Ottawa, CA;
Arkin Aydin, Nepean, CA;
Angelo Arlotta, Ottawa, CA;
Nicholas Adam Bundza, Ottawa, CA;
Alcatel Lucent, Paris, FR;
Abstract
A multi-dwelling unit (MDU) module is configured for providing telephony communicating services and non-telephony services. The MDU module includes a motherboard and a plurality of service units connected to the motherboard. Each one of said service units and the motherboard are jointly configured for providing non-telephony service and telephony service to a plurality of service subscribers. The motherboard is configured for providing overload power management to limit power consumption associated with said telephony services during an overload condition and for providing lifeline power management to limit power consumption associated with said non-telephony services during a power outage condition. The MDU module optionally includes lightning primary surge protection blocks configured for being connected to the service units. The MDU module includes a passive heat dissipation assembly that is configured for absorbing heat generated by the motherboard and the service units and for passively dissipating the heat.